High-performance ceramic/epoxy composite adhesives enabled by rational ceramic bandgaps.

ABSTRACT: High over-all properties, including low dielectric loss, high breakdown strength, high mechanical shock strength, high thermal conductivity and high weight stability, are very difficult to simultaneously achieve in electrical-insulation applicable cured potting-adhesive materials. To deal with this challenge, in this work, we have designed and fabricated a series of epoxy based composite potting-adhesives filled with low-cost and high-performance inorganic micro-particles including alpha-silica, alpha-alumina and alpha-SiC. Combination employment of high-molecular-weight and low-molecular-weight epoxy resins as matrices has been made. Heat-induced curing or crosslink of resin matrices has been carried out. Large band gap of silica filler has endowed the cured composite with high breakdown

SUBMITTER: Hu JB 

PROVIDER: S-EPMC6965657 | biostudies-literature | 2020 Jan

REPOSITORIES: biostudies-literature