Rooting binder-free tin nanoarrays into copper substrate via tin-copper alloying for robust energy storage.

ABSTRACT: The need for high-energy batteries has driven the development of binder-free electrode architectures. However, the weak bonding between the electrode particles and the current collector cannot withstand the severe volume change of active materials upon battery cycling, which largely limit the large-scale application of such electrodes. Using tin nanoarrays electrochemically deposited on copper substrate as an example, here we demonstrate a strategy of strengthening the connection between electrode and current collector by thermally alloying tin and copper at their interface. The locally formed tin-copper alloys are electron-conductive and meanwhile electrochemically inactive, working as an ideal "glue" robustly bridging tin and copper to survive harsh cycling conditions in sodium ion batte

SUBMITTER: Ni J 

PROVIDER: S-EPMC7058056 | biostudies-literature | 2020 Mar

REPOSITORIES: biostudies-literature