Dual Metastability in Electroless Plating: Complex Inertness Enabling the Deposition of Composition-Tunable Platinum Copper Alloy Nanostructures.

ABSTRACT: Autocatalytic deposition represents a facile, versatile, and scalable wet-chemical tool for nanofabrication. However, the intricate component interplay in plating baths containing multiple metal species impedes alloy deposition. We resolved this challenge in the bimetallic copper-platinum system by exploiting the kinetic stability of platinum complexes, which allows adjusting their ligand sphere and thus reactivity independently from the present copper ions in a preceding, thermally activated ligand exchange step. By using metastable Pt^IV precursors of varying degrees of complexation, copper-platinum alloys of adjustable atomic ratio were plated from solutions of identical composition and concentration, but differing local coordination environment. Due to its excellent conformit

SUBMITTER: Stohr T 

PROVIDER: S-EPMC7079153 | biostudies-literature | 2020 Mar

REPOSITORIES: biostudies-literature