Selective multi-nanosoldering for fabrication of advanced solution-processed micro/nanoscale metal grid structures.

ABSTRACT: Solution-processed metal grid transparent conductors with low sheet resistance, high optical transmittance and good mechanical flexibility have great potential for use in flexible optoelectronic devices. However, there are still remaining challenges to improve optoelectrical properties and electromechanical stability of the metallic structures due to random loose packings of nanoparticles and the existence of many pores. Here we introduce a selective multi-nanosoldering method to generate robust metallic layers on the thin metal grid structures (< a thickness of 200 nm), which are generated via self-pining assisted direct inking of silver ions. The selective multi-nanosoldering leads to lowering the sheet resistance of the metal grid transparent conductors, while keeping the optical transm

SUBMITTER: Oh YS 

PROVIDER: S-EPMC7176656 | biostudies-literature | 2020 Apr

REPOSITORIES: biostudies-literature