Hybrid multi-chip assembly of optical communication engines by in situ 3D nano-lithography.

ABSTRACT: Three-dimensional (3D) nano-printing of freeform optical waveguides, also referred to as photonic wire bonding, allows for efficient coupling between photonic chips and can greatly simplify optical system assembly. As a key advantage, the shape and the trajectory of photonic wire bonds can be adapted to the mode-field profiles and the positions of the chips, thereby offering an attractive alternative to conventional optical assembly techniques that rely on technically complex and costly high-precision alignment. However, while the fundamental advantages of the photonic wire bonding concept have been shown in proof-of-concept experiments, it has so far been unclear whether the technique can also be leveraged for practically relevant use cases with stringent reproducibility and reliability r

SUBMITTER: Blaicher M 

PROVIDER: S-EPMC7184737 | biostudies-literature | 2020

REPOSITORIES: biostudies-literature