Low-Temperature Deposition of Highly Conductive Aluminum Metal Films on Flexible Substrates Using Liquid Alane MOD Precursors.

ABSTRACT: Metal-organic decomposition (MOD) precursor inks are emerging as the new route to low-temperature deposition of highly conductive metals, owing to the tunability of their decomposition. New methods of printing are being investigated to help negate the progressive issues of the electronics industry, not least the movement toward low-cost polymers and paper substrates. Informed precursor design is crucial if achieving materials capable of this is possible. In this work, the liquid MOD precursors, dimethylethylamine alane (DMEAA) and trimethylamine alane (TEAA), have been used to deposit a highly conductive aluminum (Al) metal with resistivities in the range of 4.10 × 10-5 to 5.32 × 10-7 Ω m (mean electrical resistivity of 8 × 10-6 Ω m, approximately 300 times more resistive than bulk Al meta

SUBMITTER: Douglas SP 

PROVIDER: S-EPMC7303966 | biostudies-literature | 2020 Jun

REPOSITORIES: biostudies-literature