Adhesion layer-free attachment of gold on silicon wafer and its application in localized surface plasmon resonance-based biosensing.

ABSTRACT: The use of a metallic adhesion layer between plasmonic-active nanostructures and a solid supported is known to dampen the plasmonic response. To overcome this problem, organic adhesion layers have been introduced, which in turn can undermine the stability of the film. Moreover, both types of layers limit the regeneration of the nanostructures for multiple uses. Here we report a quick and simple approach to prepare intermediate adhesion layer-free binding of nanostructured films of gold on silicon wafers. The approach involves scratching and etching of the silicon wafer before sputter coating with a thin layer of Au. The plasmonic-active nanostructures were then prepared on this thin Au film using electrochemical deposition. As-prepared plasmonic-active nanostructured thin films of gold (PA

SUBMITTER: Bhattarai JK 

PROVIDER: S-EPMC7347289 | biostudies-literature | 2020 Sep

REPOSITORIES: biostudies-literature