Thermal Conductivity and Cure Kinetics of Epoxy-Boron Nitride Composites-A Review.

ABSTRACT: Epoxy resin composites filled with thermally conductive but electrically insulating particles play an important role in the thermal management of modern electronic devices. Although many types of particles are used for this purpose, including oxides, carbides and nitrides, one of the most widely used fillers is boron nitride (BN). In this review we concentrate specifically on epoxy-BN composites for high thermal conductivity applications. First, the cure kinetics of epoxy composites in general, and of epoxy-BN composites in particular, are discussed separately in terms of the effects of the filler particles on cure parameters and the cured composite. Then, several fundamental aspects of epoxy-BN composites are discussed in terms of their effect on thermal conductivity. These aspects includ

SUBMITTER: Hutchinson JM 

PROVIDER: S-EPMC7476057 | biostudies-literature | 2020 Aug

REPOSITORIES: biostudies-literature