The Influence of Additives on the Interfacial Width and Line Edge Roughness in Block Copolymer Lithography.

ABSTRACT: The challenges of patterning next generation integrated circuits have driven the semiconductor industry to look outside of traditional lithographic methods in order to continue cost effective size scaling. The directed self-assembly (DSA) of block copolymers (BCPs) is a nanofabrication technique used to reduce the periodicity of patterns prepared with traditional optical methods. BCPs with large interaction parameters (χeff), provide access to smaller pitches and reduced interface widths. Larger χeff is also expected to be correlated with reduced line edge roughness (LER), a critical performance parameter in integrated circuits. One approach to increasing χeff is blending the BCP with a phase selective additive, such as an Ionic liquid (IL). The IL does not impact the etching rates of eith

SUBMITTER: Sunday DF 

PROVIDER: S-EPMC7580231 | biostudies-literature | 2020

REPOSITORIES: biostudies-literature