Precise nanoscale temperature mapping in operational microelectronic devices by use of a phase change material.

ABSTRACT: The microelectronics industry is pushing the fundamental limit on the physical size of individual elements to produce faster and more powerful integrated chips. These chips have nanoscale features that dissipate power resulting in nanoscale hotspots leading to device failures. To understand the reliability impact of the hotspots, the device needs to be tested under the actual operating conditions. Therefore, the development of high-resolution thermometry techniques is required to understand the heat dissipation processes during the device operation. Recently, several thermometry techniques have been proposed, such as radiation thermometry, thermocouple based contact thermometry, scanning thermal microscopy, scanning transmission electron microscopy and transition based threshold thermomete

SUBMITTER: Cheng Q 

PROVIDER: S-EPMC7674486 | biostudies-literature | 2020 Nov

REPOSITORIES: biostudies-literature