Electromagnetic Shielding Performance of Different Metallic Coatings Deposited by Arc Thermal Spray Process.

ABSTRACT: Advancement in electronic and communication technologies bring us up to date, but it causes electromagnetic interference (EMI) resulting in failure of building and infrastructure, hospital, military base, nuclear plant, and sensitive electronics. Therefore, it is of the utmost importance to prevent the failure of structures and electronic components from EMI using conducting coating. In the present study, Cu, Cu-Zn, and Cu-Ni coating was deposited in different thicknesses and their morphology, composition, conductivity, and EMI shielding effectiveness are assessed. The scanning electron microscopy (SEM) results show that 100 µm coating possesses severe defects and porosity but once the thickness is increased to 500 µm, the porosity and electrical conductivity is gradually decreased and inc

SUBMITTER: Jang JM 

PROVIDER: S-EPMC7767199 | biostudies-literature | 2020 Dec

REPOSITORIES: biostudies-literature