Large-area integration of two-dimensional materials and their heterostructures by wafer bonding.

ABSTRACT: Integrating two-dimensional (2D) materials into semiconductor manufacturing lines is essential to exploit their material properties in a wide range of application areas. However, current approaches are not compatible with high-volume manufacturing on wafer level. Here, we report a generic methodology for large-area integration of 2D materials by adhesive wafer bonding. Our approach avoids manual handling and uses equipment, processes, and materials that are readily available in large-scale semiconductor manufacturing lines. We demonstrate the transfer of CVD graphene from copper foils (100-mm diameter) and molybdenum disulfide (MoS₂) from SiO₂/Si chips (centimeter-sized) to silicon wafers (100-mm diameter). Furthermore, we stack graphene with CVD hexagonal boron nitri

SUBMITTER: Quellmalz A 

PROVIDER: S-EPMC7876008 | biostudies-literature | 2021 Feb

REPOSITORIES: biostudies-literature