Microstructure and shear properties of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal cycling.

ABSTRACT: Through ultrasonic wave assisted Sn2.5Ag0.7Cu0.1RExNi/Cu (x = 0, 0.05, 0.1) soldering test and - 40 to 125 °C thermal shock test, the microstructure and shear properties of Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal cycling were studied by the SEM, EDS and XRD. The results show that the Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints with high quality and high reliability can be obtained by ultrasonic assistance. When the ultrasonic vibration power is 88 W, the ultrasonic-assisted Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu solder joints exhibits the optimized performance. During the thermal cycling process, the shear strength of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints had a linear relationship with the thickness of interfacial intermetallic compound (IMC). Under the thermal cycling, the i

SUBMITTER: Cui J 

PROVIDER: S-EPMC7973770 | biostudies-literature | 2021 Mar

REPOSITORIES: biostudies-literature