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Direct Pattern Growth of Carbon Nanomaterials by Laser Scribing on Spin-Coated Cu-PI Composite Films and Their Gas Sensor Application.


ABSTRACT: The excellent physical and chemical properties of carbon nanomaterials render them suitable for application in gas sensors. However, the synthesis of carbon nanomaterials using high-temperature furnaces is time consuming and expensive. In this study, we synthesize a carbon nanomaterial using local laser-scribing on a substrate coated with a Cu-embedded polyimide (PI) thin film to reduce the processing time and cost. Spin coating using a Cu-embedded PI solution is performed to deposit a Cu-embedded PI thin film (Cu@PI) on a quartz substrate, followed by the application of a pulsed laser for carbonization. In contrast to a pristine PI solution-based PI thin film, the laser absorption of the Cu-embedded PI thin film based on Cu@PI improved. The laser-scribed carbon nanomaterial synthesized using Cu@PI exhibits a three-dimensional structure that facilitates gas molecule absorption, and when it is exposed to NO2 and NH3, its electrical resistance changes by -0.79% and +0.33%, respectively.

SUBMITTER: Ko YI 

PROVIDER: S-EPMC8235262 | biostudies-literature | 2021 Jun

REPOSITORIES: biostudies-literature

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Direct Pattern Growth of Carbon Nanomaterials by Laser Scribing on Spin-Coated Cu-PI Composite Films and Their Gas Sensor Application.

Ko Yong-Il YI   Lee Geonhee G   Kim Min Jae MJ   Lee Dong Yun DY   Nam Jungtae J   Jang A-Rang AR   Lee Jeong-O JO   Kim Keun Soo KS  

Materials (Basel, Switzerland) 20210618 12


The excellent physical and chemical properties of carbon nanomaterials render them suitable for application in gas sensors. However, the synthesis of carbon nanomaterials using high-temperature furnaces is time consuming and expensive. In this study, we synthesize a carbon nanomaterial using local laser-scribing on a substrate coated with a Cu-embedded polyimide (PI) thin film to reduce the processing time and cost. Spin coating using a Cu-embedded PI solution is performed to deposit a Cu-embedd  ...[more]

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