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Bridging the"Last Millimeter" Gap of Brain-Machine Interfaces via Near-Infrared Wireless Power Transfer and Data Communications.


ABSTRACT: Arrays of floating neural sensors with high channel count that cover an area of square centimeters and larger would be transformative for neural engineering and brain-machine interfaces. Meeting the power and wireless data communications requirements within the size constraints for each neural sensor has been elusive due to the need to incorporate sensing, computing, communications, and power functionality in a package of approximately 100 micrometers on a side. In this work, we demonstrate a near infrared optical power and data communication link for a neural recording system that satisfies size requirements to achieve dense arrays and power requirements to prevent tissue heating. The optical link is demonstrated using an integrated optoelectronic device consisting of a tandem photovoltaic cell and microscale light emitting diode. End-to-end functionality of a wireless neural link within system constraints is demonstrated using a pre-recorded neural signal between a self-powered CMOS integrated circuit and single photon avalanche photodiode.

SUBMITTER: Moon E 

PROVIDER: S-EPMC8336758 | biostudies-literature | 2021 May

REPOSITORIES: biostudies-literature

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Bridging the"Last Millimeter" Gap of Brain-Machine Interfaces via Near-Infrared Wireless Power Transfer and Data Communications.

Moon Eunseong E   Barrow Michael M   Lim Jongyup J   Lee Jungho J   Nason Samuel R SR   Costello Joseph J   Kim Hun Seok HS   Chestek Cynthia C   Jang Taekwang T   Blaauw David D   Phillips Jamie D JD  

ACS photonics 20210420 5


Arrays of floating neural sensors with high channel count that cover an area of square centimeters and larger would be transformative for neural engineering and brain-machine interfaces. Meeting the power and wireless data communications requirements within the size constraints for each neural sensor has been elusive due to the need to incorporate sensing, computing, communications, and power functionality in a package of approximately 100 micrometers on a side. In this work, we demonstrate a ne  ...[more]

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