Super fine cerium hydroxide abrasives for SiO₂ film chemical mechanical planarization performing scratch free.

ABSTRACT: Face-centered-cubic crystallized super-fine (~ 2 nm in size) wet-ceria-abrasives are synthesized using a novel wet precipitation process that comprises a Ce⁴⁺ precursor, C₃H₄N₂ catalyst, and NaOH titrant for a synthesized termination process at temperature of at temperature of 25 °C. This process overcomes the limitations of chemical-mechanical-planarization (CMP)-induced scratches from conventional dry ceria abrasives with irregular surfaces or wet ceria abrasives with crystalline facets in nanoscale semiconductor devices. The chemical composition of super-fine wet ceria abrasives depends on the synthesis termination pH, that is, Ce(OH)₄ abrasives at a pH of 4.0-5.0 and a mixture of CeO₂ and Ce(OH)₄ abrasives at

SUBMITTER: Son YH 

PROVIDER: S-EPMC8421349 | biostudies-literature | 2021 Sep

REPOSITORIES: biostudies-literature