The Materials Science Foundation Supporting the Microfabrication of Reliable Polyimide-Metal Neuroelectronic Interfaces.

ABSTRACT: Thin-film polyimide-metal neuroelectronic interfaces hold the potential to alleviate many neurological disorders. However, their long-term reliability is challenged by an aggressive implant environment that causes delamination and degradation of critical materials, resulting in a degradation or complete loss of implant function. Herein, a rigorous and in-depth analysis is presented on the fabrication and modification of critical materials in these thin-film neural interfaces. Special attention is given to improving the interfacial adhesion between thin films and processing modifications to maximize device reliability. Fundamental material analyses are performed on the polyimide substrate and adhesion-promotion candidates, including amorphous silicon carbide (a-SiC:H), amorphous carbon, and

SUBMITTER: Kuliasha CA 

PROVIDER: S-EPMC8494240 | biostudies-literature | 2021 Jun

REPOSITORIES: biostudies-literature