Understanding Grain Boundary Electrical Resistivity in Cu: The Effect of Boundary Structure.

ABSTRACT: Grain boundaries (GBs) in metals usually increase electrical resistivity due to their distinct atomic arrangement compared to the grain interior. While the GB structure has a crucial influence on the electrical properties, its relationship with resistivity is poorly understood. Here, we perform a systematic study on the resistivity-structure relationship in Cu tilt GBs, employing high-resolution in situ electrical measurements coupled with atomic structure analysis of the GBs. Excess volume and energies of selected GBs are calculated using molecular dynamics simulations. We find a consistent relation between the coincidence site lattice (CSL) type of the GB and its resistivity. The most resistive GBs are in the high range of low-angle GBs (14°-18°) with twice the resistivity of high

SUBMITTER: Bishara H 

PROVIDER: S-EPMC8552493 | biostudies-literature | 2021 Oct

REPOSITORIES: biostudies-literature