Polyhedral oligosilsesquioxane-modified boron nitride enhances the mechanical properties of polyimide nanocomposites.

ABSTRACT: A novel high-strength polyimide (PI) nanocomposite film was designed and constructed by the copolymerization of epoxidized polyhedral oligomeric silsesquioxane-modified hexagonal boron nitride and polyamic acid (PAA). The composite filler (EPPOSS@Gh-BN) was composed of silane coupling agent KH550 modified hexagonal boron nitride (Gh-BN) and epoxidized polyhedral oligomeric silsesquioxanes (EPPOSS), which improved not only the dispersion of the h-BN but also the effective interfacial stress transfer, leading to an enhanced mechanical strength of the resultant PI nanocomposite film of 114 MPa even with a slight EPPOSS@Gh-BN loading of 0.30 wt%, and the storage modulus was increased by more than 30% to 4 GPa compared to pure PI. Meanwhile, the PI/EPPOSS@Gh-BN nanocomposite has better heat tra

SUBMITTER: Zhang Y 

PROVIDER: S-EPMC8982150 | biostudies-literature | 2022 Mar

REPOSITORIES: biostudies-literature