Experimental review of PEI electrodeposition onto copper substrates for insulation of complex geometries.

ABSTRACT: Polyetherimide (PEI) was used for coating copper substrates via electrophoretic deposition (EPD) for electrical insulation. Different substrate preparation and electrical field application techniques were compared, demonstrating that the use of a pulsed voltage of 20 V allowed for the best formation of insulating coatings in the 2-6 μm thickness range. The results indicate that pulsed EPD is the best technique to effectively coat conductive substrates with superior surface finish coatings that could pass a dielectric withstand test at 10 kV mm^-1, which is of importance within the EV automotive industry.

SUBMITTER: Zirignon JC 

PROVIDER: S-EPMC9042725 | biostudies-literature | 2021 Oct

REPOSITORIES: biostudies-literature