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Experimental review of PEI electrodeposition onto copper substrates for insulation of complex geometries.

ABSTRACT: Polyetherimide (PEI) was used for coating copper substrates via electrophoretic deposition (EPD) for electrical insulation. Different substrate preparation and electrical field application techniques were compared, demonstrating that the use of a pulsed voltage of 20 V allowed for the best formation of insulating coatings in the 2-6 μm thickness range. The results indicate that pulsed EPD is the best technique to effectively coat conductive substrates with superior surface finish coatings that could pass a dielectric withstand test at 10 kV mm^-1, which is of importance within the EV automotive industry.

SUBMITTER: Zirignon JC

PROVIDER: S-EPMC9042725 | biostudies-literature | 2021 Oct

REPOSITORIES: biostudies-literature

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Experimental review of PEI electrodeposition onto copper substrates for insulation of complex geometries.

Zirignon J-C JC Capezza A J AJ Xiao X X Andersson R L RL Forslund M M Dinér P P Olsson R T RT

RSC advances 20211026 55

Polyetherimide (PEI) was used for coating copper substrates <i>via</i> electrophoretic deposition (EPD) for electrical insulation. Different substrate preparation and electrical field application techniques were compared, demonstrating that the use of a pulsed voltage of 20 V allowed for the best formation of insulating coatings in the 2-6 μm thickness range. The results indicate that pulsed EPD is the best technique to effectively coat conductive substrates with superior surface finish coatings ...[more]

PMID: 35494732

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