Electroless deposition of Ni-P/Au coating on Cu substrate with improved corrosion resistance from Au(iii)-DMH based cyanide-free plating bath using hypophosphite as a reducing agent.

ABSTRACT: The green cyanide-free gold deposition is an important development direction in electroless gold plating. However, the commonly Au(i) based cyanide-free gold plating bath always suffers from severe corrosion to the Ni-P layer and unsatisfactory service life of the bath. In this work, a green and environmentally friendly cyanide-free gold plating bath was developed with hypophosphite added as a reducing agent into the Au(iii)-DMH (5,5-dimethylhydantoin) based plating bath to retard the corrosion of the Ni-P layer. SEM micrographs combined with XRD and XPS analysis indicated that the electroless deposited gold was pure and compact. And XRD also revealed that the oriented deposition of gold was growing preferentially on Au (111). Corrosion tests, including salt spray tests, potentiodynamic po

SUBMITTER: Wu B 

PROVIDER: S-EPMC9044480 | biostudies-literature | 2021 Dec

REPOSITORIES: biostudies-literature