Improved dielectric stability of epoxy composites with ultralow boron nitride loading.

ABSTRACT: Polymer-based composites have attracted increasing interest and been widely used in the field of electronic devices, but they are limited due to their low working temperature and dielectric instability. To date, there are few reports on improving the dielectric stability of polymer-based composites. Herein, three-dimensional boron nitride/nylon 66 (3D BN/PA66) aerogels are facilely prepared for the first time by freeze-drying without templates. The BN/PA66 composites are prepared by infiltrating 3D BN/PA66 aerogels with the epoxy. The thermal conductivity of the 3D BN/PA66 composite increases to 0.6 W m^-1 K^-1 due to the formation of a BN microplatelet thermal conduction network at an ultralow BN loading of 4 vol%, which is about 5-fold and 3-fold higher than that of n

SUBMITTER: Fu X 

PROVIDER: S-EPMC9060514 | biostudies-literature | 2019 Jan

REPOSITORIES: biostudies-literature