A Universal Study on the Effect Thermal Imidization Has on the Physico-Chemical, Mechanical, Thermal and Electrical Properties of Polyimide for Integrated Electronics Applications.

ABSTRACT: Polyimides (PI) are a class of dielectric polymer used in a wide range of electronics and electrical engineering applications from low-voltage microelectronics to high voltage isolation. They are well appreciated because of their excellent thermal, electrical, and mechanical properties, each of which need to be optimized uniquely depending on the end application. For example, for high-voltage applications, the final polymer breakdown field and dielectric properties must be optimized, both of which are dependent on the curing process and the final physico-chemical properties of PI. The majority of studies to date have focused on a limited set of properties of the polymer and have analyzed the effect of curing from a physicochemical-, mechanical- or electrical-centric viewpoint. This paper s

SUBMITTER: Benfridja I 

PROVIDER: S-EPMC9101791 | biostudies-literature | 2022 Apr

REPOSITORIES: biostudies-literature