A route to engineered high aspect-ratio silicon nanostructures through regenerative secondary mask lithography.

ABSTRACT: Silicon nanostructuring imparts unique material properties including antireflectivity, antifogging, anti-icing, self-cleaning, and/or antimicrobial activity. To tune these properties however, a good control over features' size and shape is essential. Here, a versatile fabrication process is presented to achieve tailored silicon nanostructures (thin/thick pillars, sharp/truncated/re-entrant cones), of pitch down to ∼50 nm, and high-aspect ratio (>10). The approach relies on pre-assembled block copolymer (BCP) micelles and their direct transfer into a glass hard mask of an arbitrary thickness, now enabled by our recently reported regenerative secondary mask lithography. During this pattern transfer, not only can the mask diameter be decreased but also uniquely increased, constituting the fir

SUBMITTER: Michalska M 

PROVIDER: S-EPMC9115640 | biostudies-literature | 2022 Feb

REPOSITORIES: biostudies-literature