Integration of multiple electronic components on a microfibre towards an emerging electronic textile platform.

ABSTRACT: Electronic fibres have been considered one of the desired device platforms due to their dimensional compatibility with fabrics by weaving with yarns. However, a precise connecting process between each electronic fibre is essential to configure the desired electronic circuits or systems. Here, we present an integrated electronic fibre platform by fabricating electronic devices onto a one-dimensional microfibre substrate. Electronic components such as transistors, inverters, ring oscillators, and thermocouples are integrated together onto the outer surface of a fibre substrate with precise semiconductor and electrode patterns. Our results show that electronic components can be integrated on a single fibre with reliable operation. We evaluate the electronic properties of the chip on the fibre

SUBMITTER: Hwang S 

PROVIDER: S-EPMC9178034 | biostudies-literature | 2022 Jun

REPOSITORIES: biostudies-literature