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Sustainable wood electronics by iron-catalyzed laser-induced graphitization for large-scale applications.

ABSTRACT: Ecologically friendly wood electronics will help alleviating the shortcomings of state-of-art cellulose-based "green electronics". Here we introduce iron-catalyzed laser-induced graphitization (IC-LIG) as an innovative approach for engraving large-scale electrically conductive structures on wood with very high quality and efficiency, overcoming the limitations of conventional LIG including high ablation, thermal damages, need for multiple lasing steps, use of fire retardants and inert atmospheres. An aqueous bio-based coating, inspired by historical iron-gall ink, protects wood from laser ablation and thermal damage while promoting efficient graphitization and smoothening substrate irregularities. Large-scale (100 cm²), highly conductive (≥2500 S m^-1) and homogeneous surface areas are engraved single-step in ambient atmosphere with a conventional CO₂ laser, even on very thin (∼450 µm) wood veneers. We demonstrate the validity of our approach by turning wood into highly durable strain sensors, flexible electrodes, capacitive touch panels and an electroluminescent LIG-based device.

SUBMITTER: Dreimol CH

PROVIDER: S-EPMC9237073 | biostudies-literature | 2022 Jun

REPOSITORIES: biostudies-literature

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Sustainable wood electronics by iron-catalyzed laser-induced graphitization for large-scale applications.

Dreimol Christopher H CH Guo Huizhang H Ritter Maximilian M Keplinger Tobias T Ding Yong Y Günther Roman R Poloni Erik E Burgert Ingo I Panzarasa Guido G

Nature communications 20220627 1

Ecologically friendly wood electronics will help alleviating the shortcomings of state-of-art cellulose-based "green electronics". Here we introduce iron-catalyzed laser-induced graphitization (IC-LIG) as an innovative approach for engraving large-scale electrically conductive structures on wood with very high quality and efficiency, overcoming the limitations of conventional LIG including high ablation, thermal damages, need for multiple lasing steps, use of fire retardants and inert atmosphere ...[more]

PMID: 35760793

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Project description:Facile fabrication of highly conductive and self-encapsulated graphene electronics is in urgent demand for carbon-based integrated circuits, field effect transistors, optoelectronic devices, and flexible sensors. The current fabrication of these electronic devices is mainly based on layer-by-layer techniques (separate circuit preparation and encapsulation procedures), which show multistep fabrication procedures, complicated renovation/repair procedures, and poor electrical property due to graphene oxidation and exfoliation. Here, we propose a laser-guided interfacial writing (LaserIW) technique based on self-confined, nickel-catalyzed graphitization to directly fabricate highly conductive, embedded graphene electronics inside multilayer structures. The doped nickel is used to induce chain carbonization, which firstly enhances the photothermal effect to increase the confined temperature for initial carbonization, and the generated carbon further increases the light-absorption capacity to fabricate high-quality graphene. Meanwhile, the nickel atoms contribute to the accelerated connection of carbon atoms. This interfacial carbonization inherently avoids the exfoliation and oxidation of the as-formed graphene, resulting in an 8-fold improvement in electrical conductivity (~20,000 S/m at 7,958 W/cm2 and 2 mm/s for 20% nickel content). The LaserIW technique shows excellent stability and reproducibility, with ±2.5% variations in the same batch and ±2% variations in different batches. Component-level wireless light sensors and flexible strain sensors exhibit excellent sensitivity (665 kHz/(W/cm2) for passive wireless light sensors) and self-encapsulation (<1% variations in terms of waterproof, antifriction, and antithermal shock). Additionally, the LaserIW technique allows for one-step renovation of in-service electronics and nondestructive repair of damaged circuits without the need to disassemble encapsulation layers. This technique reverses the layer-by-layer processing mode and provides a powerful manufacturing tool for the fabrication, modification, and repair of multilayer, multifunctional embedded electronics, especially demonstrating the immense potential for in-space manufacturing.

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Sustainable wood electronics by iron-catalyzed laser-induced graphitization for large-scale applications.

Publications

Sustainable wood electronics by iron-catalyzed laser-induced graphitization for large-scale applications.

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