Brittle fracture studied by ultra-high-speed synchrotron X-ray diffraction imaging.

ABSTRACT: In situ investigations of cracks propagating at up to 2.5 km s^-1 along an (001) plane of a silicon single crystal are reported, using X-ray diffraction megahertz imaging with intense and time-structured synchrotron radiation. The studied system is based on the Smart Cut process, where a buried layer in a material (typically Si) is weakened by microcracks and then used to drive a macroscopic crack (10^-1 m) in a plane parallel to the surface with minimal deviation (10^-9 m). A direct confirmation that the shape of the crack front is not affected by the distribution of the microcracks is provided. Instantaneous crack velocities over the centimetre-wide field of view were measured and showed an effect of local heating by the X-ray beam. The post-crack mov

SUBMITTER: Petit A 

PROVIDER: S-EPMC9348878 | biostudies-literature | 2022 Aug

REPOSITORIES: biostudies-literature