Tetrafluorophenylene-Containing Vinylbenzyl Ether-Terminated Oligo(2,6-dimethyl-1,4-phenylene ether) with Better Thermal, Dielectric, and Flame-Retardant Properties for Application in High-Frequency Communication.

ABSTRACT: In an integrated circuit, signal propagation loss is proportional to the frequency, dissipation factor (D _f), and square root of dielectric constant (D _k). The loss becomes obvious as we move to high-frequency communication. Therefore, a polymer having low D _k and D _f is critical for copper-clad laminates at higher frequencies. For this purpose, a 4-vinylbenzyl ether phenoxy-2,3,5,6-tetrafluorophenylene-terminated OPE (VT-OPE) resin was synthesized and its properties were compared with the thermoset of commercial OPE-2St resin. The thermoset of VT-OPE shows a higher T _g (242 vs 229 °C), a relatively high cross-linking density (1.59 vs 1.41 mmole cm^-3), a lower coefficient of t

SUBMITTER: Chen YC 

PROVIDER: S-EPMC9352225 | biostudies-literature | 2022 Aug

REPOSITORIES: biostudies-literature