A voting-based ensemble feature network for semiconductor wafer defect classification.

ABSTRACT: Semiconductor wafer defects severely affect product development. In order to reduce the occurrence of defects, it is necessary to identify why they occur, and it can be inferred by analyzing the patterns of defects. Automatic defect classification (ADC) is used to analyze large amounts of samples. ADC can reduce human resource requirements for defect inspection and improve inspection quality. Although several ADC systems have been developed to identify and classify wafer surfaces, the conventional ML-based ADC methods use numerous image recognition features for defect classification and tend to be costly, inefficient, and time-consuming. Here, an ADC technique based on a deep ensemble feature framework (DEFF) is proposed that classifies different kinds of wafer surface damage automatically

SUBMITTER: Misra S 

PROVIDER: S-EPMC9519991 | biostudies-literature | 2022 Sep

REPOSITORIES: biostudies-literature