Leaflet Stresses During Full Device Simulation of Crimping to 6 mm in Transcatheter Aortic Valve Implantation, TAVI.

ABSTRACT:

Background

With continuing growth in transcatheter aortic valve implantation for the treatment of a failing aortic valve, there is increasing interest in prosthetic valve durability and the potential damage caused to leaflets by stress. Whilst most available research into the computational prediction of leaflet stresses using finite element analysis, FEA, has focussed on variations during dynamic loading, very little appears to have been reported for the impact of crimping, even though awareness of this effect is widespread. Potentially, this has been due to the difficulty of performing full model simulations of crimping to clinically meaningful diameters.

Method

A full model comprising a self-expanding frame, skirt and leaflets has been developed and crimped to a final diam

SUBMITTER: Bressloff NW 

PROVIDER: S-EPMC9616759 | biostudies-literature | 2022 Oct

REPOSITORIES: biostudies-literature