Ultrastrong MXene films via the synergy of intercalating small flakes and interfacial bridging.

ABSTRACT: Titanium carbide MXene combines high mechanical and electrical properties and low infrared emissivity, making it of interest for flexible electromagnetic interference (EMI) shielding and thermal camouflage film materials. Conventional wisdom holds that large MXene is the preferable building block to assemble high-performance films. However, the voids in the films comprising large MXene degrade their properties. Although traditional crosslinking strategies can diminish the voids, the electron transport between MXene flakes is usually disrupted by the insulating polymer bonding agents, reducing the electrical conductivity. Here we demonstrate a sequential densification strategy to synergistically remove the voids between MXene flakes while strengthening the interlayer electron transport. Sma

SUBMITTER: Wan S 

PROVIDER: S-EPMC9708659 | biostudies-literature | 2022 Nov

REPOSITORIES: biostudies-literature