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One-Step Gas-Solid-Phase Diffusion-Induced Elemental Reaction for Bandgap-Tunable CuaAgm1Bim2In/CuI Thin Film Solar Cells.


ABSTRACT: Lead-free inorganic copper-silver-bismuth-halide materials have attracted more and more attention due to their environmental friendliness, high element abundance, and low cost. Here, we developed a strategy of one-step gas-solid-phase diffusion-induced reaction to fabricate a series of bandgap-tunable CuaAgm1Bim2In/CuI bilayer films due to the atomic diffusion effect for the first time. By designing and regulating the sputtered Cu/Ag/Bi metal film thickness, the bandgap of CuaAgm1Bim2In could be reduced from 2.06 to 1.78 eV. Solar cells with the structure of FTO/TiO2/CuaAgm1Bim2In/CuI/carbon were constructed, yielding a champion power conversion efficiency of 2.76%, which is the highest reported for this class of materials owing to the bandgap reduction and the peculiar bilayer structure. The current work provides a practical path for developing the next generation of efficient, stable, and environmentally friendly photovoltaic materials.

SUBMITTER: Fan E 

PROVIDER: S-EPMC9981855 | biostudies-literature | 2023 Mar

REPOSITORIES: biostudies-literature

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One-Step Gas-Solid-Phase Diffusion-Induced Elemental Reaction for Bandgap-Tunable Cu<sub>a</sub>Ag<sub>m1</sub>Bi<sub>m2</sub>I<sub>n</sub>/CuI Thin Film Solar Cells.

Fan Erchuang E   Liu Manying M   Yang Kangni K   Jiang Siyu S   Li Bingxin B   Zhao Dandan D   Guo Yanru Y   Zhang Yange Y   Zhang Peng P   Zuo Chuantian C   Ding Liming L   Zheng Zhi Z  

Nano-micro letters 20230302 1


Lead-free inorganic copper-silver-bismuth-halide materials have attracted more and more attention due to their environmental friendliness, high element abundance, and low cost. Here, we developed a strategy of one-step gas-solid-phase diffusion-induced reaction to fabricate a series of bandgap-tunable Cu<sub>a</sub>Ag<sub>m1</sub>Bi<sub>m2</sub>I<sub>n</sub>/CuI bilayer films due to the atomic diffusion effect for the first time. By designing and regulating the sputtered Cu/Ag/Bi metal film thic  ...[more]

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