Electronic Packaging Enhancement Engineered by Reducing the Bonding Temperature via Modified Cure Cycles.

ABSTRACT: Semiconductor packaging continues to reduce in thickness following the overall thinning of electronic devices such as smartphones and tablets. As the package becomes thinner, the warpage of the semiconductor package becomes more important due to the reduced bending stiffness and driven by thermal residual stresses and thermal expansion mismatch during the epoxy molding compound (EMC) curing to create the package. To address this packaging reliability issue, in this study, we developed a modified cure cycle that adds a rapid cooling step to the conventional cure cycle (CCC) to enhance the reliability of the EMC molded to a copper substrate (EMC/Cu bi-layer package) by lowering the bonding temperature of the EMC/Cu bi-layer package. Modeling of the package via Timoshenko theory including eff

SUBMITTER: Park SY 

PROVIDER: S-EPMC9982811 | biostudies-literature | 2023 Mar

REPOSITORIES: biostudies-literature