Polyimide/crown ether composite film with low dielectric constant and low dielectric loss for high signal transmission.

ABSTRACT: Dielectric properties of polyimide (PI) are constrained by its inherent molecular structure and inter-chain packing capacities. The compromised dielectric properties of PI, however, could be rescued by introducing trifluoromethyl and forming a host-guest inclusion complex with the introduction of crown ethers (CEs). Herein, we report PI/crown ether composite films as a communication substrate that could be applied under high frequency circumstances. In this work, three kinds of bisphenol A-containing diamine (2,2'-bis[4-(4-aminophenoxy)phenyl]propane, 2,2-bis[4-(2-methyl-4-aminophenoxy)phenyl]propane, and 2,2-bis[4-(2-trifluoro methyl-4-aminophenoxy)phenyl]propane) are synthesized and polymerized with 4,4'-(hexafluoroisopropylidene)diphthalic anhydride to prepare low-dielectric PI films by

SUBMITTER: Li H 

PROVIDER: S-EPMC9993404 | biostudies-literature | 2023 Mar

REPOSITORIES: biostudies-literature