Silver Nanoparticle-Deposited Boron Nitride Nanosheets as Fillers for Polymeric Composites with High Thermal Conductivity.
ABSTRACT: Polymer composites with high thermal conductivity have recently attracted much attention, along with the rapid development of the electronic devices toward higher speed and performance. However, a common method to enhance polymer thermal conductivity through an addition of high thermally conductive fillers usually cannot provide an expected value, especially for composites requiring electrical insulation. Here, we show that polymeric composites with silver nanoparticle-deposited boron nitride nanosheets as fillers could effectively enhance the thermal conductivity of polymer, thanks to the bridging connections of silver nanoparticles among boron nitride nanosheets. The thermal conductivity of the composite is significantly increased from 1.63?W/m-K for the composite filled with the silver nanoparticle-deposited boron nitride nanosheets to 3.06?W/m-K at the boron nitride nanosheets loading of 25.1 vol %. In addition, the electrically insulating properties of the composite are well preserved. Fitting the measured thermal conductivity of epoxy composite with one physical model indicates that the composite with silver nanoparticle-deposited boron nitride nanosheets outperforms the one with boron nitride nanosheets, owning to the lower thermal contact resistance among boron nitride nanosheets' interfaces. The finding sheds new light on enhancement of thermal conductivity of the polymeric composites which concurrently require the electrical insulation.
Project description:A strategy was reported to prepare boron nitride nanosheets (BNNSs) by a molten hydroxide assisted liquid exfoliation from hexagonal boron nitride (h-BN) powder. BNNSs with an average thickness of 3?nm were obtained by a facile, low-cost, and scalable exfoliation method. Highly thermally conductive polyimide (PI) composite films with BNNSs filler were prepared by solution-casting process. The in-plane thermal conductivity of PI composite films with 7?wt% BNNSs is up to 2.95?W/mK, which increased by 1,080% compared to the neat PI. In contrast, the out-of plane thermal conductivity of the composites is 0.44?W/mK, with an increase by only 76%. The high anisotropy of thermal conductivity was verified to be due to the high alignment of the BNNSs. The PI/BNNSs composite films are attractive for the thermal management applications in the field of next-generation electronic devices.
Project description:The development of highly thermally conductive composites with excellent electrical insulation has attracted extensive attention, which is of great significance to solve the increasingly severe heat concentration issue of electronic equipment. Herein, we report a new strategy to prepare boron nitride nanosheets (BNNSs) via an ion-assisted liquid-phase exfoliation method. Then, silver nanoparticle (AgNP) modified BNNS (BNNS@Ag) was obtained by in situ reduction properties. The exfoliation yield of BNNS was approximately 50% via the ion-assisted liquid-phase exfoliation method. Subsequently, aramid nanofiber (ANF)/BNNS@Ag composites were prepared by vacuum filtration. Owing to the "brick-and-mortar" structure formed inside the composite and the adhesion of AgNP, the interfacial thermal resistance was effectively reduced. Therefore, the in-plane thermal conductivity of ANF/BNNS@Ag composites was as high as 11.51 W m<sup>-1</sup> K<sup>-1</sup>, which was 233.27% higher than that of pure ANF (3.45 W m<sup>-1</sup> K<sup>-1</sup>). The addition of BNNS@Ag maintained tensile properties (tensile strength of 129.14 MPa). Moreover, the ANF/BNNS@Ag films also had good dielectric properties and the dielectric constant was below 2.5 (10<sup>3</sup> Hz). Hence, the ANF/BNNS@Ag composite shows excellent thermal management performance, and the electrical insulation and mechanical properties of the matrix are retained, indicating its potential application prospects in high pressure and high temperature application environments.
Project description:Thermal management has become a critical challenge in electronics and portable devices. To address this issue, polymer composites with high thermal conductivity (TC) and low dielectric property are urgently needed. In this work, we fabricated perfluoroalkoxy (PFA) composite with high anisotropic TC and low dielectric constant by aligning boron nitride nanosheets (BNNs) via hot pressing. We characterized the thermal stability, microstructure, in-plane and through-plane TCs, heat dissipation capability, and dielectric property of the composites. The results indicate that the BNNs-PFA composites possessed good thermal stability. When the BNNs content was higher than 10 wt %, the BNNs were well layer aligned in the PFA matrix, and the composites showed obvious anisotropic TC. The in-plane TC and through-plane TCs of 30 wt % BNNs-PFA composite were 4.65 and 1.94 W m-1 K-1, respectively. By using the composite in thermal management of high-power LED, we found that alignment of BNNs in composite significantly improves the heat dissipation capability of composite. In addition, the composites exhibited a low dielectric property. This study shows that hot pressing is a facile and low-cost method to fabricate bulk composite with anisotropic TC, which has wide applications in electronic packaging.
Project description:Thermal conductive polymer composites (filled type) consisting of thermal conductive fillers and a polymer matrix have been widely used in a range of areas. More than 10 strategies have been developed to improve the thermal conductivity of polymer composites. Here we report a new "hypergravity accumulation" strategy. Raw material mixtures of boron nitride/silicone rubber composites were treated in hypergravity fields (800-20,000 g, relative gravity acceleration) before heat-curing. A series of comparison studies were made. It was found that hypergravity treatments could efficiently improve the microstructures and thermal conductivity of the composites. When the hypergravity was about 20,000 g (relative gravity acceleration), the obtained spherical boron nitride/silicone rubber composites had highly compacted microstructures and high and isotropic thermal conductivity. The highest thermal conductivity reached 4.0 W/mK. Thermal interface application study showed that the composites could help to decrease the temperature on a light-emitting diode (LED) chip by 5 °C. The mechanism of the improved microstructure increased thermal conductivity, and the high viscosity problem in the preparation of boron nitride/silicone rubber composites, and the advantages and disadvantages of the hypergravity accumulation strategy, were discussed. Overall, this work has provided a new, efficient, and simple strategy to improve the thermal conductivity of boron nitride/silicone rubber and other polymer composites (filled type).
Project description:High-thermal-conductivity and low-dielectric-loss polymer nanocomposites have gained tremendous attention in microelectronics technology. Against this background, the present study deals with the development of a high-thermal-conductivity, low-dielectric-constant, and low-loss polymer nanocomposite based on silver nanoparticle (AgNP)-decorated boron nitride nanosheets (BNNSs) as the filler in poly(methyl methacrylate) (PMMA) matrix. The nanocomposites were prepared through a facile solution-blending process. Elemental mapping of the prepared nanocomposite indicates the uniform distribution of filler particle in PMMA matrix. An impressive high-thermal conductivity (TC) enhancement of around 363% was achieved for nanocomposite of 0.35 <i>V</i> <sub>f</sub> of hybrid filler (1.48 W/m K) compared to pristine PMMA (0.32 W/m K). The addition of AgNP reduces the thermal contact resistance (<i>R</i> <sub>c</sub>) by bridging individual BNNS, thereby improving thermal transport. Measured TC values were fitted with a theoretical model that showed good agreement. Dielectric measurements performed at radiofrequencies and microwave frequencies revealed that the nanocomposites show a low dielectric constant (<5), low loss (10<sup>-2</sup>), and very low alternating current conductivity (10<sup>-7</sup> S/cm). The results suggest that silver-decorated BNNS is a promising hybrid filler for effective thermal management.
Project description:In this study, we demonstrate the use of silicone/few-layered hexagonal boron nitride (FL-hBN) composites for heat dissipation applications. FL-hBN is synthesized via a green, facile, low-cost and scalable liquid exfoliation method using a jet cavitation process. The crystal structures, surface morphologies and specific surface areas of pristine h-BN and FL-hBN were characterized by XRD, SEM, TEM and AFM (atomic force microscopy). The results confirmed that FL-hBN with a thickness of ~4 nm was successfully obtained from the exfoliation process. In addition, we introduced both pristine h-BN and FL-hBN into silicone with different ratios to study their thermal properties. The results of the laser flash analysis indicate that the silicon/FL-hBN composite exhibited a higher thermal conductivity than that of the silicone/h-BN composite. With the optimal loading content of 30 wt.% FL-hBN content, the thermal conductivity of the composite could be enhanced to 230%, which is higher than that of silicone/h-BN (189%). These results indicate that jet cavitation is an effective and swift way to obtain few-layered hexagonal boron nitride that could effectively enhance the thermal conductivity of silicone composites.
Project description:Boron nitride nanosheets (BNNS) hold the similar two-dimensional structure as graphene and unique properties complementary to graphene, which makes it attractive in application ranging from electronics to energy storage. The exfoliation of boron nitride (BN) still remains challenge and hinders the applications of BNNS. In this work, the preparation of BNNS has been realized by a shear-assisted supercritical CO2 exfoliation process, during which supercritical CO2 intercalates and diffuses between boron nitride layers, and then the exfoliation of BN layers is obtained in the rapid depressurization process by overcoming the van der Waals forces. Our results indicate that the bulk boron nitride has been successfully exfoliated into thin nanosheets with an average 6 layers. It is found that the produced BNNS is well-dispersed in isopropyl alcohol (IPA) with a higher extinction coefficient compared with the bulk BN. Moreover, the BNNS/epoxy composite used as thermal interface materials has been prepared. The introduction of BNNS results in a 313% enhancement in thermal conductivity. Our results demonstrate that BNNS produced by supercritical CO2 exfoliation show great potential applications for heat dissipation of high efficiency electronics.
Project description:The high thermal conductivity and good insulating properties of boron nitride (BN) make it a promising filler for high-performance polymer-based thermal management materials. An easy way to prepare BN-polymer composites is to directly mix BN particles with polymer matrix. However, a high concentration of fillers usually leads to a huge reduction of mechanical strength and optical transmission. Here, we propose a novel method to prepare polyethylene/boron nitride nanoplates (PE/BNNPs) composites through the combination of electrostatic self-assembly and hot pressing. Through this method, the thermal conductivity of the PE/BNNPs composites reach 0.47 W/mK, which gets a 14.6% improvement compared to pure polyethylene film. Thanks to the tight bonding of polyethylene with BNNPs, the tensile strength of the composite film reaches 1.82 MPa, an increase of 173.58% compared to that of pure polyethylene film (0.66 MPa). The fracture stress was also highly enhanced, with an increase of 148.44% compared to pure polyethylene film. Moreover, the addition of BNNPs in PE does not highly reduce its good transmittance, which is preferred for thermal management in devices like light-emitting diodes. This work gives an insight into the preparation strategy of transparent and flexible thermal management materials with high thermal conductivity.
Project description:Development of polymer-based composites with simultaneously high thermal conductivity and breakdown strength has attracted considerable attention owing to their important applications in both electronic and electric industries. In this work, boron nitride (BN) nanofibers (BNNF) are successfully prepared as fillers, which are used for epoxy composites. In addition, the BNNF in epoxy composites are aligned by using a film casting method. The composites show enhanced thermal conductivity and dielectric breakdown strength. For instance, after doping with BNNF of 2 wt%, the thermal conductivity of composites increased by 36.4% in comparison with that of the epoxy matrix. Meanwhile, the breakdown strength of the composite with 1 wt% BNNF is 122.9 kV/mm, which increased by 6.8% more than that of neat epoxy (115.1 kV/mm). Moreover, the composites have maintained a low dielectric constant and alternating current conductivity among the range of full frequency, and show a higher thermal decomposition temperature and glass-transition temperature. The composites with aligning BNNF have wide application prospects in electronic packaging material and printed circuit boards.
Project description:Dielectric materials with good thermal transport performance and desirable dielectric properties have significant potential to address the critical challenges of heat dissipation for microelectronic devices and power equipment under high electric field. This work reported the role of synergistic effect and interface on through-plane thermal conductivity and dielectric properties by intercalating the hybrid fillers of the alumina and boron nitride nanosheets (BNNs) into epoxy resin. For instance, epoxy composite with hybrid fillers at a relatively low loading shows an increase of around 3 times in through-plane thermal conductivity and maintains a close dielectric breakdown strength compared to pure epoxy. Meanwhile, the epoxy composite shows extremely low dielectric loss of 0.0024 at room temperature and 0.022 at 100 ? and 10<sup>-1</sup> Hz. And covalent bonding and hydrogen-bond interaction models were presented for analyzing the thermal conductivity and dielectric properties.