From 2D to 3D: Strain- and elongation-free topological transformations of optoelectronic circuits.

ABSTRACT: Optoelectronic circuits in 3D shapes with large deformations can offer additional functionalities inaccessible to conventional planar electronics based on 2D geometries constrained by conventional photolithographic patterning processes. A light-sensing focal plane array (FPA) used in imagers is one example of a system that can benefit from fabrication on curved surfaces. By mimicking the hemispherical shape of the retina in the human eye, a hemispherical FPA provides a low-aberration image with a wide field of view. Due to the inherently high value of such applications, intensive efforts have been devoted to solving the problem of transforming a circuit fabricated on a flat wafer surface to an arbitrary shape without loss of performance or distorting the linear layouts that are the natural product of this fabrication paradigm. Here we report a general approach for fabricating electronic circuits and optoelectronic devices on nondevelopable surfaces by introducing shear slip of thin-film circuit components relative to the distorting substrate. In particular, we demonstrate retina-like imagers that allow for a topological transformation from a plane to a hemisphere without changing the relative positions of the pixels from that initially laid out on a planar surface. As a result, the resolution of the imager, particularly in the foveal region, is not compromised by stretching or creasing that inevitably results in transforming a 2D plane into a 3D geometry. The demonstration provides a general strategy for realizing high-density integrated circuits on randomly shaped, nondevelopable surfaces.

SUBMITTER: Fan D 

PROVIDER: S-EPMC6410875 | biostudies-literature | 2019 Mar

REPOSITORIES: biostudies-literature