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Electrochemical migration behavior of moldy printed circuit boards in a 10 mT magnetic field.

ABSTRACT: In the electrochemical migration behavior (ECM) of printed circuit boards containing mold under a static magnetic field (SMF), the role of the field perpendicular to the electrodes is discussed; the B field inhibits the growth and metabolism of mold, while controlling electrochemical diffusion and nucleation. The field indirectly affects the function of mold as a transmission bridge between two electrodes. In this work, the water drop test was used to simulate the adhesion and growth of mold on the circuit board in a humid and hot environment; confocal laser scanning microscopy, scanning electron microscopy, energy dispersive spectroscopy, Raman spectra, and a scanning Kelvin probe were used to analyze the mechanism of static magnetic field and mold on the electrochemical migration.

SUBMITTER: Liu X

PROVIDER: S-EPMC9038071 | biostudies-literature | 2021 Aug

REPOSITORIES: biostudies-literature

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Electrochemical migration behavior of moldy printed circuit boards in a 10 mT magnetic field.

Liu Xuan X Bai Ziheng Z Liu Qianqian Q Feng Yali Y Dong Chaofang C Lu Lin L Luo Hong H Wang Jirui J Zou Shiwen S Xiao Kui K

RSC advances 20210820 45

In the electrochemical migration behavior (ECM) of printed circuit boards containing mold under a static magnetic field (SMF), the role of the field perpendicular to the electrodes is discussed; the <i>B</i> field inhibits the growth and metabolism of mold, while controlling electrochemical diffusion and nucleation. The field indirectly affects the function of mold as a transmission bridge between two electrodes. In this work, the water drop test was used to simulate the adhesion and growth of m ...[more]

PMID: 35480762

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