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Glass-to-Glass Fusion Bonding Quality and Strength Evaluation with Time, Applied Force, and Heat.


ABSTRACT: A bonding process was developed for glass-to-glass fusion bonding using Borofloat 33 wafers, resulting in high bonding yield and high flexural strength. The Borofloat 33 wafers went through a two-step process with a pre-bond and high-temperature bond in a furnace. The pre-bond process included surface activation bonding using O2 plasma and N2 microwave (MW) radical activation, where the glass wafers were brought into contact in a vacuum environment in an EVG 501 Wafer Bonder. The optimal hold time in the EVG 501 Wafer bonder was investigated and concluded to be a 3 h hold time. The bonding parameters in the furnace were investigated for hold time, applied force, and high bonding temperature. It was concluded that the optimal parameters for glass-to-glass Borofloat 33 wafer bonding were at 550 °C with a hold time of 1 h with 550 N of applied force.

SUBMITTER: Trinh NN 

PROVIDER: S-EPMC9695810 | biostudies-literature | 2022 Nov

REPOSITORIES: biostudies-literature

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Glass-to-Glass Fusion Bonding Quality and Strength Evaluation with Time, Applied Force, and Heat.

Trinh Nhi N NN   Simms Leslie A LA   Chew Bradley S BS   Weinstein Alexander A   La Saponara Valeria V   McCartney Mitchell M MM   Kenyon Nicholas J NJ   Davis Cristina E CE  

Micromachines 20221102 11


A bonding process was developed for glass-to-glass fusion bonding using Borofloat 33 wafers, resulting in high bonding yield and high flexural strength. The Borofloat 33 wafers went through a two-step process with a pre-bond and high-temperature bond in a furnace. The pre-bond process included surface activation bonding using O<sub>2</sub> plasma and N<sub>2</sub> microwave (MW) radical activation, where the glass wafers were brought into contact in a vacuum environment in an EVG 501 Wafer Bonde  ...[more]

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