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Rapid photonic curing effects of xenon flash lamp on ITO-Ag-ITO multilayer electrodes for high throughput transparent electronics.


ABSTRACT: High-throughput transparent and flexible electronics are essential technologies for next-generation displays, semiconductors, and wearable bio-medical applications. However, to manufacture a high-quality transparent and flexible electrode, conventional annealing processes generally require 5 min or more at a high temperature condition of 300 °C or higher. This high thermal budget condition is not only difficult to apply to general polymer-based flexible substrates, but also results in low-throughput. Here, we report a high-quality transparent electrode produced with an extremely low thermal budget using Xe-flash lamp rapid photonic curing. Photonic curing is an extremely short time (~ μs) process, making it possible to induce an annealing effect of over 800 °C. The photonic curing effect was optimized by selecting the appropriate power density, the irradiation energy of the Xe-flash lamp, and Ag layer thickness. Rapid photonic curing produced an ITO-Ag-ITO electrode with a low sheet resistance of 6.5 ohm/sq, with a high luminous transmittance of 92.34%. The low thermal budget characteristics of the rapid photonic curing technology make it suitable for high-quality transparent electronics and high-throughput processes such as roll-to-roll.

SUBMITTER: Zhao Z 

PROVIDER: S-EPMC9852449 | biostudies-literature | 2023 Jan

REPOSITORIES: biostudies-literature

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Rapid photonic curing effects of xenon flash lamp on ITO-Ag-ITO multilayer electrodes for high throughput transparent electronics.

Zhao Zhenqian Z   Rose Alex A   Kwon Sang Jik SJ   Jeon Yongmin Y   Cho Eou-Sik ES  

Scientific reports 20230119 1


High-throughput transparent and flexible electronics are essential technologies for next-generation displays, semiconductors, and wearable bio-medical applications. However, to manufacture a high-quality transparent and flexible electrode, conventional annealing processes generally require 5 min or more at a high temperature condition of 300 °C or higher. This high thermal budget condition is not only difficult to apply to general polymer-based flexible substrates, but also results in low-throug  ...[more]

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