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Damage-free plasma etching of porous organo-silicate low-k using micro-capillary condensation above -50 °C.

ABSTRACT: The micro-capillary condensation of a new high boiling point organic reagent (HBPO), is studied in a periodic mesoporous oxide (PMO) with ?34 % porosity and k-value ?2.3. At a partial pressure of 3 mT, the onset of micro-capillary condensation occurs around +20 °C and the low-k matrix is filled at -20 °C. The condensed phase shows high stability from -50 < T ?-35 °C, and persists in the pores when the low-k is exposed to a SF6-based plasma discharge. The etching properties of a SF6-based 150W-biased plasma discharge, using as additive this new HBPO gas, shows that negligible damage can be achieved at -50 °C, with acceptable etch rates. The evolution of the damage depth as a function of time was studied without bias and indicates that Si-CH3 loss occurs principally through Si-C dissociation by VUV photons.

SUBMITTER: Chanson R

PROVIDER: S-EPMC5789876 | biostudies-other | 2018 Jan

REPOSITORIES: biostudies-other

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Damage-free plasma etching of porous organo-silicate low-k using micro-capillary condensation above -50 °C.

Chanson R R Zhang L L Naumov S S Mankelevich Yu A YA Tillocher T T Lefaucheux P P Dussart R R Gendt S De S Marneffe J-F de JF

Scientific reports 20180130 1

The micro-capillary condensation of a new high boiling point organic reagent (HBPO), is studied in a periodic mesoporous oxide (PMO) with ∼34 % porosity and k-value ∼2.3. At a partial pressure of 3 mT, the onset of micro-capillary condensation occurs around +20 °C and the low-k matrix is filled at -20 °C. The condensed phase shows high stability from -50 < T ≤-35 °C, and persists in the pores when the low-k is exposed to a SF<sub>6</sub>-based plasma discharge. The etching properties of a SF<sub ...[more]

PMID: 29382890

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