Study of the effect of Sn grain boundaries on IMC morphology in solid state inter-diffusion soldering.

ABSTRACT: This paper reports on 3D phase field simulations of IMC growth in Co/Sn and Cu/Sn solder systems. In agreement with experimental micrographs, we obtain uniform growth of the CoSn₃ phase in Co/Sn solder joints and a non-uniform wavy morphology for the Cu₆Sn₅ phase in Cu/Sn solder joints. Furthermore, simulations were performed to obtain an insight in the impact of Sn grain size, grain boundary versus bulk diffusion, IMC/Sn interface mobility and Sn grain boundary mobility on IMC morphology and growth kinetics. It is found that grain boundary diffusion in the IMC or Sn phase have a limited impact on the IMC evolution. A wavy IMC morphology is obtained in the simulations when the grain boundary mobility in the Sn phase is relatively large compared to the inter

SUBMITTER: Hou L 

PROVIDER: S-EPMC6795889 | biostudies-literature | 2019 Oct

REPOSITORIES: biostudies-literature