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Comparison of NiO x thin film deposited by spin-coating or thermal evaporation for application as a hole transport layer of perovskite solar cells.


ABSTRACT: We compared nickel oxide (NiO x ) deposited by thermal evaporation and that deposited by the spin-coating process, for use in the hole transport layers of inverted planar perovskite solar cells (PSCs). Spin-coating deposition for NiO x HTL has been widely used, owing to its simplicity, low cost, and high efficiency. However, the spin-coating process has a technical limit to depositing a large-area uniformly. In contrast, thermal evaporation fabrication has a low price and is able to produce uniform and reproducible thin film. Hence, the chemical states, energy band alignment, surface morphologies, and microstructures of NiO x deposited by spin coating and thermal evaporation were analyzed. The PSC with NiO x HTL deposited by thermal evaporation showed a higher power conversion efficiency of 16.64% with open circuit voltage 1.07 V, short circuit current density of 20.68 mA cm-2, and a fill factor of 75.51% compared to that of PSC with spin-coated NiO x . We confirmed that thermal evaporation can deposit NiO x to give a better performance as a HTL with higher reproducibility than spin-coating.

SUBMITTER: Kim SK 

PROVIDER: S-EPMC9058328 | biostudies-literature | 2020 Nov

REPOSITORIES: biostudies-literature

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Comparison of NiO <sub><i>x</i></sub> thin film deposited by spin-coating or thermal evaporation for application as a hole transport layer of perovskite solar cells.

Kim Su-Kyung SK   Seok Hae-Jun HJ   Kim Do-Hyung DH   Choi Dong-Hyeok DH   Nam Seung-Ju SJ   Kim Suk-Cheol SC   Kim Han-Ki HK  

RSC advances 20201101 71


We compared nickel oxide (NiO <sub><i>x</i></sub> ) deposited by thermal evaporation and that deposited by the spin-coating process, for use in the hole transport layers of inverted planar perovskite solar cells (PSCs). Spin-coating deposition for NiO <sub><i>x</i></sub> HTL has been widely used, owing to its simplicity, low cost, and high efficiency. However, the spin-coating process has a technical limit to depositing a large-area uniformly. In contrast, thermal evaporation fabrication has a l  ...[more]

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